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New packages for disc type power diodes
- Source :
-
Materials Science & Engineering: B . Sep2012, Vol. 177 Issue 15, p1304-1309. 6p. - Publication Year :
- 2012
-
Abstract
- Abstract: The paper presents a press-pack package integrated with a microchannel cooling system, which is a new thermal solution for power devices, e.g. diodes. In comparison with conventional solutions enforcing the use of either an air cooling system or a liquid one, the novel package is characterised by considerably smaller dimensions, lower weight and significantly higher thermal performance. The conducted measurements of the manufactured model showed that a thermal resistance of 0.0182K/W can be obtained for an allowable pressure drop for electronic applications. [Copyright &y& Elsevier]
Details
- Language :
- English
- ISSN :
- 09215107
- Volume :
- 177
- Issue :
- 15
- Database :
- Academic Search Index
- Journal :
- Materials Science & Engineering: B
- Publication Type :
- Academic Journal
- Accession number :
- 79806192
- Full Text :
- https://doi.org/10.1016/j.mseb.2012.04.001