Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing.

MLA

Zhao, Dewen, et al. “Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing.” IEEE Transactions on Semiconductor Manufacturing, vol. 25, no. 3, Aug. 2012, pp. 502–10. EBSCOhost, https://doi.org/10.1109/TSM.2012.2190432.

APA

Zhao, D., He, Y., Wang, T., & Lu, X. (2012). Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing. IEEE Transactions on Semiconductor Manufacturing, 25(3), 502–510. https://doi.org/10.1109/TSM.2012.2190432

Chicago

Zhao, Dewen, Yongyong He, Tongqing Wang, and Xinchun Lu. 2012. “Effect of Kinematic Parameters and Their Coupling Relationships on Global Uniformity of Chemical-Mechanical Polishing.” IEEE Transactions on Semiconductor Manufacturing 25 (3): 502–10. doi:10.1109/TSM.2012.2190432.