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Study of precision micro-holes in borosilicate glass using micro EDM combined with micro ultrasonic vibration machining
- Source :
-
International Journal of Machine Tools & Manufacture . Aug2002, Vol. 42 Issue 10, p1105. 8p. - Publication Year :
- 2002
-
Abstract
- Because of its excellent anodic bonding property and surface integrity, borosilicate glass is usually used as the substrate for micro-electro mechanical systems (MEMS). For building the communication interface, micro-holes need to be drilled on this substrate. However, a micro-hole with diameter below 200 μm is difficult to manufacture using traditional machining processes. To solve this problem, a machining method that combines micro electrical-discharge machining (MEDM) and micro ultrasonic vibration machining (MUSM) is proposed herein for producing precise micro-holes with high aspect ratios in borosilicate glass. In the investigations described in this paper, a circular micro-tool was produced using the MEDM process. This tool was then used to drill a hole in glass using the MUSM process. The experiments showed that using appropriate machining parameters; the diameter variations between the entrances and exits (DVEE) could reach a value of about 2 μm in micro-holes with diameters of about 150 μm and depths of 500 μm. DVEE could be improved if an appropriate slurry concentration; ultrasonic amplitude or rotational speed was utilized. In the roundness investigations, the machining tool rotation speed had a close relationship to the degree of micro-hole roundness. Micro-holes with a roundness value of about 2 μm (the max. radius minus the min. radius) could be obtained if the appropriate rotational speed was employed. [Copyright &y& Elsevier]
- Subjects :
- *GLASS
*MICROELECTROMECHANICAL systems
Subjects
Details
- Language :
- English
- ISSN :
- 08906955
- Volume :
- 42
- Issue :
- 10
- Database :
- Academic Search Index
- Journal :
- International Journal of Machine Tools & Manufacture
- Publication Type :
- Academic Journal
- Accession number :
- 7866902
- Full Text :
- https://doi.org/10.1016/S0890-6955(02)00061-5