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Strain rate sensitivity and activation volume of Cu/Ni metallic multilayer thin films measured via micropillar compression.
- Source :
-
Applied Physics Letters . 7/30/2012, Vol. 101 Issue 5, p051901. 4p. 1 Black and White Photograph, 2 Charts, 3 Graphs. - Publication Year :
- 2012
-
Abstract
- Micropillar compression testing with repeated jumps in strain rate is used to circumvent inherent difficulties associated with nanoindentation and tensile testing of free-standing films. Application to sputtered 21 nm/21 nm Cu/Ni multilayer thin films with a cube-on-cube texture reveals an average strain rate sensitivity (m = 0.014) and activation volume (V = 17 b3), comparable to nanocrystalline face-centered cubic metals. Yet, m increases by ∼50% and V decreases by 70% with increasing strain, opposite to trends reported for nanotwinned Cu. The large, strain-dependent shifts in m and V are dependent on the underlying misfit dislocation structure of Cu/Ni interfaces. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 101
- Issue :
- 5
- Database :
- Academic Search Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 78299184
- Full Text :
- https://doi.org/10.1063/1.4739521