Six cases of reliability study of Pb-free solder joints in electronic packaging technology

MLA

Zeng, K., and K. N. Tu. “Six Cases of Reliability Study of Pb-Free Solder Joints in Electronic Packaging Technology.” Materials Science & Engineering: R, vol. 38, no. 2, June 2002, p. 55. EBSCOhost, https://doi.org/10.1016/S0927-796X(02)00007-4.

APA

Zeng, K., & Tu, K. N. (2002). Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Materials Science & Engineering: R, 38(2), 55. https://doi.org/10.1016/S0927-796X(02)00007-4

Chicago

Zeng, K., and K.N. Tu. 2002. “Six Cases of Reliability Study of Pb-Free Solder Joints in Electronic Packaging Technology.” Materials Science & Engineering: R 38 (2): 55. doi:10.1016/S0927-796X(02)00007-4.