Cite
Board level reliability of a stacked CSP subjected to cyclic bending
MLA
Wu, J. D., et al. “Board Level Reliability of a Stacked CSP Subjected to Cyclic Bending.” Microelectronics Reliability, vol. 42, no. 3, Mar. 2002, p. 407. EBSCOhost, https://doi.org/10.1016/S0026-2714(01)00241-4.
APA
Wu, J. D., Ho, S. H., Huang, C. Y., Liao, C. C., Zheng, P. J., & Hung, S. C. (2002). Board level reliability of a stacked CSP subjected to cyclic bending. Microelectronics Reliability, 42(3), 407. https://doi.org/10.1016/S0026-2714(01)00241-4
Chicago
Wu, J.D., S.H. Ho, C.Y. Huang, C.C. Liao, P.J. Zheng, and S.C. Hung. 2002. “Board Level Reliability of a Stacked CSP Subjected to Cyclic Bending.” Microelectronics Reliability 42 (3): 407. doi:10.1016/S0026-2714(01)00241-4.