The crack growth behavior of Incoloy 800H under fatigue and dwell-fatigue conditions at elevated temperature.

Fatigue crack growth rate (FCGR) tests with different load ratios and dwell-fatigue crack growth rate (DFCGR) tests with different dwell times were conducted at 750°C for Incoloy 800H. As the load ratio increases from 0.1 to 0.5, the crack growth rate increased and the transition ΔK value from region I to region II (Paris regime) shifted leftward. In DFCGR tests with dwell time of 10 and 30 seconds, the Paris regime started at relatively lower ΔK level and the crack grew much faster than in FCGR tests. However, the crack growth rates between the 10 sec and 30 sec dwell times were relatively similar. The higher crack growth rates in the DFCGR tests compared to FCGR tests was associated with the reduction of the MC precipitates in the vicinity of the advancing crack by the Cr depletion, suggesting the crack propagation in DFCGR conditions was environmentally assisted. The crack growth rate was controlled by trans-granular mode regardless of the dwell time because the dwell time was not enough to cause creep damage. [ABSTRACT FROM AUTHOR]