Recrystallization, Grain Growth in Copper Foil at High Temperature Studied By Electron Back Scatter Diffraction.

As-received cold rolled and isothermally re-crystallized textures of high purity copper foil were studied using electron back-scattered diffraction patterns (EBSD) in a scanning electron microscope. The evolution of the re-crystallization texture was investigated as a function of annealing temperature. In as is sample, the Cu grains are small and equi-axed, but re-crystallization results in grains several microns in size. We observe a significant enhancement of the (311) texture by pole figure measurements till annealing temperatures of 400 °C and then enhancement of (200) texture at annealing temperatures of 600 °C. We propose that multiple twinning is the mechanism for this phenomenon. [ABSTRACT FROM AUTHOR]