Cite
Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory.
MLA
Agwai, Abigail, et al. “Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory.” IEEE Transactions on Components, Packaging & Manufacturing Technology, vol. 2, no. 3, Sept. 2012, pp. 439–47. EBSCOhost, https://doi.org/10.1109/TCPMT.2011.2175924.
APA
Agwai, A., Guven, I., & Madenci, E. (2012). Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory. IEEE Transactions on Components, Packaging & Manufacturing Technology, 2(3), 439–447. https://doi.org/10.1109/TCPMT.2011.2175924
Chicago
Agwai, Abigail, Ibrahim Guven, and Erdogan Madenci. 2012. “Drop-Shock Failure Prediction in Electronic Packages by Using Peridynamic Theory.” IEEE Transactions on Components, Packaging & Manufacturing Technology 2 (3): 439–47. doi:10.1109/TCPMT.2011.2175924.