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Hierarchical Compact Models for Simulation of Electronic Chip Packages.
- Source :
-
IEEE Transactions on Components & Packaging Technologies . Jun2002, Vol. 25 Issue 2, p192. 12p. 9 Diagrams, 12 Charts. - Publication Year :
- 2002
-
Abstract
- Presents study that developed a methodology called coefficient-based resistance agglomeration (COBRA) for automatically creating hierarchical compact models of increasing complexity. Basic methodology for deriving network conductances through least-squares optimization; Description of the key point discretization and COBRA procedures; Idealizations made in creating the detailed computational fluid dynamics model from which the compact models are made.
- Subjects :
- *AGGLOMERATION (Materials)
*LEAST squares
*FLUID dynamics
Subjects
Details
- Language :
- English
- ISSN :
- 15213331
- Volume :
- 25
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- IEEE Transactions on Components & Packaging Technologies
- Publication Type :
- Academic Journal
- Accession number :
- 6874514
- Full Text :
- https://doi.org/10.1109/TCAPT.2002.1010006