3D crack network analysis during a scratch test of a polymer: A combined experimental and multigrid X-FEM based numerical approach

Abstract: The scratch behavior of a thermoset solid polymer exhibiting brittle behavior in tension is investigated. The surfaces are scratched and an imaging system is used to record real time photographs. The 3D crack pattern is analyzed using fluorescence confocal laser scanning microscopy. A finite element simulation is performed to determine the indenter/specimen contact conditions. They are used as input data for the 3D crack network analysis based on combined 3D localized multigrid and X-FEM/level set techniques. The computed stress distributions within the 3D cracked specimen are of great interest to understand the crack network formation observed during the experiments. [Copyright &y& Elsevier]