Relationship between composition, structure, and mechanical properties of a condensed composite of copper-tungsten system.

For a copper-tungsten microlayered composite material for electrical contact applications, which is prepared by electron-beam evaporation-condensation, the changes in its structure, conductivity, hardness, and mechanical properties in tension at room temperature and elevated temperatures are studied versus the tungsten content and heat treatment conditions. New morphological features of the condensed composite and the related changes in the material properties have been revealed. The conditions for the formation of structural defects and their influence on mechanical properties and fracture behavior of the material in tensile tests have been investigated. A relationship has been established between the tungsten content of the composite, its structure, strength, and hardness. [ABSTRACT FROM AUTHOR]