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Fracture behavior of Cu-cored solder joints.
- Source :
-
Journal of Materials Science . Nov2011, Vol. 46 Issue 21, p6897-6903. 7p. 3 Color Photographs, 1 Black and White Photograph, 1 Chart, 3 Graphs. - Publication Year :
- 2011
-
Abstract
- Copper-cored solder can be regarded as the next-generation solder for microelectronic semiconductors exposed to harsh operating conditions owing to its excellent sustainability under extreme thermal conditions, e.g., in microelectronic semiconductors used in transportation systems. Cu-cored solder joints with two different coating layers, Sn-3.0Ag and Sn-1.0In, were compared with the baseline Sn-3.0Ag-0.5Cu solder. The fracture strength and failure mode were examined using the high-speed ball-pull and normal-speed shear tests. The Cu-cored solder joint with the Sn-1.0In plating layer exhibited the highest ball-pull and shear strengths. In addition, it showed a much lower percentage of interface fracture between the Cu-core and plating layer than the interface fracture percentage in the Sn-3.0Ag plating layer due to the improved wettability between the Cu-core and Sn-1.0In plating layer. [ABSTRACT FROM AUTHOR]
- Subjects :
- *MICROELECTRONIC packaging
*SOLDER & soldering
*INDIUM
*COPPER
*ELECTRODIFFUSION
Subjects
Details
- Language :
- English
- ISSN :
- 00222461
- Volume :
- 46
- Issue :
- 21
- Database :
- Academic Search Index
- Journal :
- Journal of Materials Science
- Publication Type :
- Academic Journal
- Accession number :
- 63994932
- Full Text :
- https://doi.org/10.1007/s10853-011-5654-x