Cite
Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes
MLA
Tsai, M. Y., et al. “Determination of Residual Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes.” Microelectronics Reliability, vol. 51, no. 3, Mar. 2011, pp. 642–48. EBSCOhost, https://doi.org/10.1016/j.microrel.2010.10.009.
APA
Tsai, M. Y., Ting, C. W., Huang, C. Y., & Lai, Y.-S. (2011). Determination of residual strains of the EMC in PBGA during manufacturing and IR solder reflow processes. Microelectronics Reliability, 51(3), 642–648. https://doi.org/10.1016/j.microrel.2010.10.009
Chicago
Tsai, M.Y., C.W. Ting, C.Y. Huang, and Yi-Shao Lai. 2011. “Determination of Residual Strains of the EMC in PBGA during Manufacturing and IR Solder Reflow Processes.” Microelectronics Reliability 51 (3): 642–48. doi:10.1016/j.microrel.2010.10.009.