3D Stacked Microprocessor: Are We There Yet?

The article looks at the views of a variety of researchers, executives and other technological leaders from a range of institutions about three-dimensional (3D) integration technology for microprocessors. It focuses on 3D stacking technology based on through-silicon-via (TSV) technology. It is believed that the first commercial 3D integrated microprocessor products will feature memory stacked on a processor and that will produce some benefits like increase in bandwidth and in on-chip storage capacity. Based on the comments of the respondents, the said microprocessors will likely be commercialized within a few years.