The Solidification Path of the Complex Metallic Al-Mn-Be Alloy.

The solidification paths of the Al86.1Mn2.5Be11.4 and Al84Mn5.1Be10.9 alloys, melt spun, cast into a copper mould and controlled cooled (during DSC) were investigated by means of light-optical microscopy (LOM), differential scanning calorimetry (DSC) combined with thermogravimetry (TG) or simultaneous thermal analysis (STA), scanning electron microscopy (SEM), transmission electron microscopy (TEM), Auger electron spectroscopy (AES) and the X-ray diffraction (XRD) line in Elletra Trieste, Italy. The con- stitutions of samples from both alloys were examined in all three states, i.e., after melt spinning, after casting into a copper mould and after differential scanning calorimetry. It was established that in the cast and controlled-cooled specimens the alloys consisted of an aluminium-rich αAI-matrix, and the AI4Mn and Be4AIMn phases. In the case of casting and DSC the primary crystallization began with the precipitation of the Be4AlMn phase, followed by what can most likely be characterized as a uni-variant binary eutectic reaction L→ (Be4AlMn + Al4Mn). The solidification process continued with an invariant ternary eutectic reaction, where the remaining melt (L) formed the heterogeneous structure (αAI + AI4Mn + Be4AIMn) or a ternary eutectic. When extremely high cooling rates were employed, as is the case with melt-spinning, the constituting phases of both alloys were precipitated in a very small form and the Be4AIMn phase was completely absent in the form of primary polygonal particles and replaced by the icosahedral quasicrystal- line phase or the i-phase. There was also no evidence of the AI4Mn phase. The distribution, size and shape of all the constituents in the melt-spun alloys also varied from the contact surface towards the free surface of the ribbons. The smallest constituents were established at the contact surface, measuring less than 0.1 μm, to 0.5 μm at the free surface. The grains of the aluminium-rich matrix had mean diameters of less than 20 μm, close to the free surface, down to 1 μm at the contact surface. [ABSTRACT FROM AUTHOR]