Stress analysis of Si1− x Ge x embedded source/drain junctions

Abstract: The purpose of this paper is to evaluate the impact of the geometry of embedded Si1− x Ge x source/drain junctions on the stress field. Stress simulations were performed using TSUPREM4 2D software to further investigate the elastic strain relaxation as a function of Si1− x Ge x alloy active size, in the regime where no plastic relaxation is present. Moreover, the role of the epilayer thickness and the Ge content on the stress levels is also discussed. The work is complemented with experimental Raman spectroscopy. [Copyright &y& Elsevier]