Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents.

MLA

Barbagini, Francesca, et al. “Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents.” Journal of Adhesion Science & Technology, vol. 23, no. 12, Aug. 2009, pp. 1709–21. EBSCOhost, https://doi.org/10.1163/016942409X12459095670430.

APA

Barbagini, F., Halder, S., Janssens, T., Kenis, K., Wostyn, K., Bearda, T., Toan-Le Quoc, Leunissen, P., Mertens, P., Kyung-Hyun Kim, & Andreas, M. (2009). Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents. Journal of Adhesion Science & Technology, 23(12), 1709–1721. https://doi.org/10.1163/016942409X12459095670430

Chicago

Barbagini, Francesca, Sandip Halder, Tom Janssens, Karine Kenis, Kurt Wostyn, Twan Bearda, Toan-Le Quoc, et al. 2009. “Particle Removal Efficiency and Damage Analysis on Silicon Wafers after Megasonic Cleaning in Solvents.” Journal of Adhesion Science & Technology 23 (12): 1709–21. doi:10.1163/016942409X12459095670430.