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Antibacterial activity of ciprofloxacin-loaded zein microsphere films

Authors :
Fu, Jian-Xi
Wang, Hua-Jie
Zhou, Yan-Qing
Wang, Jin-Ye
Source :
Materials Science & Engineering: C. May2009, Vol. 29 Issue 4, p1161-1166. 6p.
Publication Year :
2009

Abstract

Abstract: Our aim was to produce an antibiotic-emitting coating composed of zein microspheres for the prevention of bacterial infection on implanted devices. Ciprofloxacin-loaded zein microspheres were prepared using a phase separation procedure, with particle sizes between 0.5 and 2 µm. Drug encapsulation and drug loading varied with the amount of both zein and ciprofloxacin, and the highest encapsulation efficiency was 8.27% (2 mg/ml ciprofloxacin and 20 mg/ml zein; n =3). A ciprofloxacin-loaded zein microsphere film (CF-MS film) was generated via solvent evaporation. Continuous drug release from a trypsin-degraded microsphere film was observed for up to 28 days. The liberation of ciprofloxacin from the trypsin-degraded film and the biodegradation of the microsphere film were highly correlated. Proliferation assay of the growth of human umbilical vein endothelial cells (HUVECs) by the MTT method showed that the microsphere film had no toxicity when compared with cells grown on Corning culture plates alone and plates with a zein film alone. Quantification of bacteria adhesion showed that adhesion on the microsphere film is significantly suppressed. In addition, according to the results of bacterial growth tests, ciprofloxacin-loaded microsphere films maintained antibacterial activity for more than 6 days. In contrast, a control medium containing a zein film allowed constant bacterial growth. These results indicate that CF-MS films might be useful as antibacterial films on implanted devices. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
09284931
Volume :
29
Issue :
4
Database :
Academic Search Index
Journal :
Materials Science & Engineering: C
Publication Type :
Academic Journal
Accession number :
38319312
Full Text :
https://doi.org/10.1016/j.msec.2008.09.031