Prediction of the maximal recalescence temperature upon rapid solidification of bulk undercooled Cu70Ni30 alloy

MLA

Yang, W., et al. “Prediction of the Maximal Recalescence Temperature upon Rapid Solidification of Bulk Undercooled Cu70Ni30 Alloy.” Journal of Alloys & Compounds, vol. 470, no. 1/2, Feb. 2009, pp. L13–16. EBSCOhost, https://doi.org/10.1016/j.jallcom.2008.02.074.

APA

Yang, W., Liu, F., Wang, H. F., Chen, Z., Yang, G. C., & Zhou, Y. H. (2009). Prediction of the maximal recalescence temperature upon rapid solidification of bulk undercooled Cu70Ni30 alloy. Journal of Alloys & Compounds, 470(1/2), L13–L16. https://doi.org/10.1016/j.jallcom.2008.02.074

Chicago

Yang, W., F. Liu, H.F. Wang, Z. Chen, G.C. Yang, and Y.H. Zhou. 2009. “Prediction of the Maximal Recalescence Temperature upon Rapid Solidification of Bulk Undercooled Cu70Ni30 Alloy.” Journal of Alloys & Compounds 470 (1/2): L13–16. doi:10.1016/j.jallcom.2008.02.074.