Transmission property of flip chip package with adhesive interconnection for RF applications

MLA

Kim, Jong-Woong, et al. “Transmission Property of Flip Chip Package with Adhesive Interconnection for RF Applications.” Microelectronic Engineering, vol. 86, no. 3, Mar. 2009, pp. 314–20. EBSCOhost, https://doi.org/10.1016/j.mee.2008.10.012.

APA

Kim, J.-W., Nah, W., & Jung, S.-B. (2009). Transmission property of flip chip package with adhesive interconnection for RF applications. Microelectronic Engineering, 86(3), 314–320. https://doi.org/10.1016/j.mee.2008.10.012

Chicago

Kim, Jong-Woong, Wansoo Nah, and Seung-Boo Jung. 2009. “Transmission Property of Flip Chip Package with Adhesive Interconnection for RF Applications.” Microelectronic Engineering 86 (3): 314–20. doi:10.1016/j.mee.2008.10.012.