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Study of thickness and grain size effects on material behavior in micro-forming

Authors :
Yeh, Fung-Huei
Li, Ching-Lun
Lu, Yuung-Hwa
Source :
Journal of Materials Processing Technology. May2008, Vol. 201 Issue 1-3, p237-241. 5p.
Publication Year :
2008

Abstract

Abstract: With the development of the technology, miniature and portability become the trends in manufacturing business. It is more and more important to miniaturize blank size in micro-forming process as well. Therefore, the researchers of micro-forming focus on this trend and try their best to study the problems and find the best solution. This paper presents an effective and practical mathematical modeling to describe the material behavior of any thickness and any grain size in micro-forming. Using this modeling, the cylindrical micro-cup deep drawing is analyzed by explicit dynamic finite element method. The simulation results show that thickness variety and stress distribution are reasonable. This investigation proves that the new mathematical modeling of material behavior will supply a useful modeling which takes into account the thickness and grain size effects in micro-forming. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
09240136
Volume :
201
Issue :
1-3
Database :
Academic Search Index
Journal :
Journal of Materials Processing Technology
Publication Type :
Academic Journal
Accession number :
31559476
Full Text :
https://doi.org/10.1016/j.jmatprotec.2007.11.138