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Integrating Thermal Management and Burn-in Operations.
- Source :
-
Advanced Packaging . Oct2007, Vol. 16 Issue 7, p28-32. 4p. - Publication Year :
- 2007
-
Abstract
- The article discusses the new approach to prevent thermal dissipation and power variance in semiconductor processing. It states that advancements of this industry have led to thermal dissipation and power variances which affect manufacturer's production efficiencies and margins. However, these technical hurdles can be prevented by combining thermal management and burn-in operations. Moreover, the details of the new process are also presented.
Details
- Language :
- English
- ISSN :
- 10650555
- Volume :
- 16
- Issue :
- 7
- Database :
- Academic Search Index
- Journal :
- Advanced Packaging
- Publication Type :
- Periodical
- Accession number :
- 27044473