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Investigation of moisture-induced failures of stacked-die package
- Source :
-
Microelectronics Reliability . Sep2007, Vol. 47 Issue 9-11, p1673-1679. 7p. - Publication Year :
- 2007
-
Abstract
- Abstract: The present work studies the moisture induced failures of a stacked-die package. The study includes various experimental tests to find the characteristics of constituent packaging materials such as interfacial strength, hygro-swelling property and vapor pressure, and a comprehensive finite element analysis integrating the effects of the hygro-swelling stress, the thermo-mechanical stress and the vapor pressure. Specifically, the vapor pressures with respect to the moisture concentration and the temperature in epoxy molding compound were characterized experimentally by combined TMA/TGA technique. In the numerical stress analysis, the interfacial delamination was newly simulated by applying a cohesive element modeling technique, in which a quadratic traction damage initiation law and an exponential displacement separation law were used. [Copyright &y& Elsevier]
- Subjects :
- *FINITE element method
*MOISTURE
*CONDENSATION
*PACKAGING
Subjects
Details
- Language :
- English
- ISSN :
- 00262714
- Volume :
- 47
- Issue :
- 9-11
- Database :
- Academic Search Index
- Journal :
- Microelectronics Reliability
- Publication Type :
- Academic Journal
- Accession number :
- 26682412
- Full Text :
- https://doi.org/10.1016/j.microrel.2007.07.014