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The Use of Accelerated Full-Wave Modeling to Analyze Power Island Coupling in a HyperBGA SCM.

Authors :
Morsey, Jason
Deutsch, Alina
Libous, J. P.
Surovic, C.
Rubin, Barry J.
Lijun Jiang
Eisenberg, L.
Source :
IEEE Transactions on Advanced Packaging. May2007, Vol. 30 Issue 2, p288-294. 7p.
Publication Year :
2007

Abstract

Presented here are results and recommendations for reducing coupling between adjacent power islands based on full-wave simulations of a HyperBGA SCM (single-chip module). These simulations highlight the use of IBM's internally developed accelerated full-wave solver based on the precorrected fast Fourier transform approach. Speedups of 100× and memory reductions of 12× are shown for real engineering problems, as compared to direct integral equation solutions. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
15213323
Volume :
30
Issue :
2
Database :
Academic Search Index
Journal :
IEEE Transactions on Advanced Packaging
Publication Type :
Academic Journal
Accession number :
25368264
Full Text :
https://doi.org/10.1109/TADVP.2007.896005