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Ballistic thermal conductance in a three-dimensional quantum wire modulated with stub structure.
- Source :
-
Applied Physics Letters . 5/7/2007, Vol. 90 Issue 19, p193502. 3p. 1 Diagram, 1 Graph. - Publication Year :
- 2007
-
Abstract
- Ballistic thermal conductance in a three-dimensional quantum wire with a stub structure is presented under both stress-free and hard wall boundary conditions at low temperatures. A comparative analysis for two-dimensional and three-dimensional models is made. The results show that when stress-free boundary conditions are applied, the universal quantum thermal conductance can be observed regardless of the geometry details in the limit T→0, and the behavior of the thermal conductance is qualitatively similar to that calculated by two-dimensional model. However, when hard wall boundary conditions are applied, the thermal conductance displays different behaviors in both two-dimensional and three-dimensional models. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00036951
- Volume :
- 90
- Issue :
- 19
- Database :
- Academic Search Index
- Journal :
- Applied Physics Letters
- Publication Type :
- Academic Journal
- Accession number :
- 25128065
- Full Text :
- https://doi.org/10.1063/1.2737363