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Integrated dynamic simulation of rapid thermal chemical vapor deposition of polysilicon.

Authors :
Lu, Guangquan
Bora, Monalisa
Tedder, Laura L.
Rubloff, Gary W.
Source :
IEEE Transactions on Semiconductor Manufacturing. Feb98, Vol. 11 Issue 1, p63. 12p. 3 Black and White Photographs, 4 Diagrams, 1 Chart, 6 Graphs.
Publication Year :
1998

Abstract

Presents information pertaining to the rapid thermal chemical vapor deposition (RTCVD) of polysilicon. Information on the capacity of the simulator; What role the computer simulation plays; Basis of the mathematical models for equipment and materials processes.

Subjects

Subjects :
*RAPID thermal processing

Details

Language :
English
ISSN :
08946507
Volume :
11
Issue :
1
Database :
Academic Search Index
Journal :
IEEE Transactions on Semiconductor Manufacturing
Publication Type :
Academic Journal
Accession number :
244754
Full Text :
https://doi.org/10.1109/66.661286