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Microstructuring of glassy carbon mold for glass embossing – Comparison of focused ion beam, nano/femtosecond-pulsed laser and mechanical machining

Authors :
Youn, S.W.
Takahashi, M.
Goto, H.
Maeda, R.
Source :
Microelectronic Engineering. Nov2006, Vol. 83 Issue 11/12, p2482-2492. 11p.
Publication Year :
2006

Abstract

Abstract: Various methods, including focused ion beam (FIB), femto-second laser, KrF eximer laser and dicing techniques, were employed for preparing glassy carbon (GC) micro-molds, and those methods were characterized in terms of the process rate, the roughness and the shape of machined structure. FIB milling using a repetitive pass method produced nano/microstructures with flat channel bottom and nearly vertical sidewalls. Although FIB milling was slowest process, it provided the best quality of machined surface (R a =4–30nm depended on milled depth). Femtosecond-pulsed laser machining also allowed fabricating flat bottom and nearly vertical sidewalls on an area of 1.2×1.2mm2 at a scanning speed of 20mm/s, but lead to an increase of the surface roughness (R a =80nm). Femto-second laser in combination with FIB milling provided a possibility for the rapid fabrication of high quality microstructures on wide surface area. The roughness of machined surface decreased to 45nm by the subsequent FIB milling. Microstructuring with a nanosecond-pulsed KrF eximer laser at an irradiation wavelength of 248nm with a fluence of 13.2J/cm2 also allowed the fast fabrication of master structure for micro-gear, resulted in slanted sidewalls and not ideally flat bottoms. The surface roughness (R a) of the bottom and the side wall was about 45 and 70nm, respectively. Dicing technique allowed machining micro-channels with a rectangular and pyramidal cross-section on an area of 15×15mm2 under the feed speed of 50mm/min. By reducing the feeding speed from 100mm/min to 50mm/min, surface roughness (R a) of the structure side wall decreased from 150nm to 70nm. Achieved glassy carbon molds were then applied to the hot-emboss process of Pyrex and quartz glasses to investigate embossing conditions (emboss temperature, pressure and hold time) needed for the replication of Pyrex and quartz glass structures with various geometries and dimensions in glass plates with thickness of 1mm. Replication results showed good replication at the nanoscale, resulted in the almost the same dimensions and surface roughness with that of cavities. Thicker plate provided faster filling in the emboss process of glass. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
01679317
Volume :
83
Issue :
11/12
Database :
Academic Search Index
Journal :
Microelectronic Engineering
Publication Type :
Academic Journal
Accession number :
23205710
Full Text :
https://doi.org/10.1016/j.mee.2006.05.007