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Gold Ball Bumping.
- Source :
-
Advanced Packaging . May/Jun2006, Vol. 15 Issue 5, p36-38. 3p. - Publication Year :
- 2006
-
Abstract
- The article offers information on gold ball bumping, an effective wafer-bumping method. The factors to consider when wafer bumping are coplanarity, conductivity, thermal properties, size and reliability. The process is emerging as a cost-effective, reliable method for many applications, especially as companies change to meet restriction of the use of certain hazardous substances compliance and eliminate lead in their process.
Details
- Language :
- English
- ISSN :
- 10650555
- Volume :
- 15
- Issue :
- 5
- Database :
- Academic Search Index
- Journal :
- Advanced Packaging
- Publication Type :
- Periodical
- Accession number :
- 21258968