Phase-change material assumes custom shapes.

The article provides information on PCM45F-SP, a phase-change material developed by Honeywell Electronic Materials as of April 2006. The product can be applied by engineers using a printing process, making it more adaptable to integrated circuit designs than traditional thermal-management materials that come on tape rolls. It can assume a variety of shapes based on the screen print of the chip. The materials provide higher production efficiency and better thermal performance than thermal-management products.