Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications.

MLA

Yangyang Sun, et al. “Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications.” IEEE Transactions on Components & Packaging Technologies, vol. 29, no. 1, Mar. 2006, pp. 190–97. EBSCOhost, https://doi.org/10.1109/TCAPT.2006.870389.

APA

Yangyang Sun, Zhuqing Zhang, & Wong, C. P. (2006). Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications. IEEE Transactions on Components & Packaging Technologies, 29(1), 190–197. https://doi.org/10.1109/TCAPT.2006.870389

Chicago

Yangyang Sun, Zhuqing Zhang, and C. P. Wong. 2006. “Study and Characterization on the Nanocomposite Underfill for Flip Chip Applications.” IEEE Transactions on Components & Packaging Technologies 29 (1): 190–97. doi:10.1109/TCAPT.2006.870389.