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A probabilistic model for prediction of bonding time in diffusion bonding

Authors :
Li, Shu-Xin
Tu, Shan-Tung
Xuan, Fu-Zhen
Source :
Materials Science & Engineering: A. Oct2005, Vol. 407 Issue 1/2, p250-255. 6p.
Publication Year :
2005

Abstract

Abstract: A probabilistic model for prediction of bonding time in diffusion bonding is presented based on the stochastic characteristics of surface finish of bonded area. The probabilistic distribution of surface roughness is introduced into a deterministic model of diffusion bonding by taking the parameters of void radius and height as random variables. Monte Carlo simulation technique in conjunction with numerical integration is used to calculate the bonding time and its probabilistic distribution. The sensitivity analysis of parameters is then performed to evaluate the effects of creep exponent and surface roughness on the bonding time. Comparison is also made between the theoretical predictions and available experimental results from previous work on Ti–6Al–4V alloy in order to validate the probabilistic model. The proposed model showed a good agreement with the experimental results. [Copyright &y& Elsevier]

Details

Language :
English
ISSN :
09215093
Volume :
407
Issue :
1/2
Database :
Academic Search Index
Journal :
Materials Science & Engineering: A
Publication Type :
Academic Journal
Accession number :
18730700
Full Text :
https://doi.org/10.1016/j.msea.2005.07.003