Cite
Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed powders.
MLA
Huang, J. H., et al. “Reactive Diffusion Bonding of SiCp/Al Composites by Insert Layers of Mixed Powders.” Materials Science & Technology, vol. 21, no. 10, Oct. 2005, pp. 1217–21. EBSCOhost, https://doi.org/10.1179/174328405X51631.
APA
Huang, J. H., Dong, Y. L., Wan, Y., Zhang, J. G., & Zhou, G. A. (2005). Reactive diffusion bonding of SiCp/Al composites by insert layers of mixed powders. Materials Science & Technology, 21(10), 1217–1221. https://doi.org/10.1179/174328405X51631
Chicago
Huang, J. H., Y. L. Dong, Y. Wan, J. G. Zhang, and G. A. Zhou. 2005. “Reactive Diffusion Bonding of SiCp/Al Composites by Insert Layers of Mixed Powders.” Materials Science & Technology 21 (10): 1217–21. doi:10.1179/174328405X51631.