Back to Search
Start Over
Cladding technique for development of Ag–In–Cd decoupler
- Source :
-
Journal of Nuclear Materials . Aug2005, Vol. 343 Issue 1-3, p154-162. 9p. - Publication Year :
- 2005
-
Abstract
- Abstract: To develop a Ag (silver)–In (indium)–Cd (cadmium) alloy decoupler, a method is needed to bond the decoupler between two plates of the Al alloy (A6061-T6). We found that a better HIP condition was temperature, pressure and holding time at 803K, 100MPa and 1h, respectively, for small test pieces (ϕ 22mm in diam.×5mm in height). Especially, a sandwich case (a Ag–In plate with thickness of 0.5mm between two Ag–Cd plates with thickness of 1.25mm) gave easier (or better) bonding results. Though a hardened layer is found in the bonding layer, the rupture strength of the bonding layer is more than 30MPa, which is higher than the design stress in our application. [Copyright &y& Elsevier]
Details
- Language :
- English
- ISSN :
- 00223115
- Volume :
- 343
- Issue :
- 1-3
- Database :
- Academic Search Index
- Journal :
- Journal of Nuclear Materials
- Publication Type :
- Academic Journal
- Accession number :
- 18195331
- Full Text :
- https://doi.org/10.1016/j.jnucmat.2004.08.036