INTEGRATION OF ACTIVE THIN FILMS WITH SILICON COMPATIBLE MATERIALS AND PROCESS SCIENCE PROTOCOLS FOR MEMS SCALE VIBRATION DAMPING APPLICATIONS.

MLA

Cole, M. W., et al. “Integration of Active Thin Films with Silicon Compatible Materials and Process Science Protocols for Mems Scale Vibration Damping Applications.” Integrated Ferroelectrics, vol. 71, no. 1, May 2005, pp. 81–98. EBSCOhost, https://doi.org/10.1080/10584580590964718.

APA

Cole, M. W., Nothwang, W. D., Hirsch, S., Mohanchandra, K. P., Demaree, J. D., & Carman, G. P. (2005). Integration of Active Thin Films with Silicon Compatible Materials and Process Science Protocols for Mems Scale Vibration Damping Applications. Integrated Ferroelectrics, 71(1), 81–98. https://doi.org/10.1080/10584580590964718

Chicago

Cole, M. W., W. D. Nothwang, S. Hirsch, K. P. Mohanchandra, J. D. Demaree, and G. P. Carman. 2005. “Integration of Active Thin Films with Silicon Compatible Materials and Process Science Protocols for Mems Scale Vibration Damping Applications.” Integrated Ferroelectrics 71 (1): 81–98. doi:10.1080/10584580590964718.