Growth mechanism and tribological behavior of electroless Ni-P plating with ultrasonic assistance on titanium alloy substrate.

MLA

Cao, Jingjing, et al. “Growth Mechanism and Tribological Behavior of Electroless Ni-P Plating with Ultrasonic Assistance on Titanium Alloy Substrate.” Ferroelectrics, vol. 618, no. 15/16, Nov. 2024, pp. 2562–80. EBSCOhost, https://doi.org/10.1080/00150193.2024.2320562.

APA

Cao, J., Yang, J., Zhao, W., & Li, H. (2024). Growth mechanism and tribological behavior of electroless Ni-P plating with ultrasonic assistance on titanium alloy substrate. Ferroelectrics, 618(15/16), 2562–2580. https://doi.org/10.1080/00150193.2024.2320562

Chicago

Cao, Jingjing, Junheng Yang, Wenwu Zhao, and Hezong Li. 2024. “Growth Mechanism and Tribological Behavior of Electroless Ni-P Plating with Ultrasonic Assistance on Titanium Alloy Substrate.” Ferroelectrics 618 (15/16): 2562–80. doi:10.1080/00150193.2024.2320562.