Preparation and reliability test of diamond/aluminum composites.

Diamond/aluminum composites have the advantages of high thermal conductivity and low density, making them ideal cooling materials for aerospace electronic devices. However, there is a lack of comprehensive research on the factors influencing the thermal conductivity of diamond/aluminum composites, as well as their reliability. In view of the above problems, spark plasma sintering method was utilized to prepare diamond/aluminum composites with a thermal conductivity of 462 W/(m·K). It considered the effects of sintering temperature, holding time, and diamond particle size combination. Additionally, the heat spreader reliability of this diamond/aluminum composite in high and low temperature and vibration environment was studied. The results demonstrated that the diamond/aluminum composite effectively reduced the heat source temperature by 13 °C compared to aluminum alloy when subjected to a heat flux of 70 W/cm². Furthermore, diamond/aluminum composites can maintain stable physical properties and structural reliability in the high and low temperature and vibration environment, effectively exerting their heat dissipation capacity. Overall, diamond/aluminum composites can be presented as a reliable solution for heat dissipation in aerospace electronic devices. [ABSTRACT FROM AUTHOR]