Discharge characteristics of silicon-based DC Helium microplasmas: comparison between Through Silicon Via and closed cavity type micro-reactors.

This paper explores the microfabrication process of plasma reactors, from the production of micro-reactors to the addition of through silicon vias (TSV) using proprietary etching techniques and on site cleanroom facilities. The investigation focuses on both newly fabricated closed and open-cavity micro-hollow cathode discharge (MHCD) reactors, with particular emphasis on electrical and optical diagnostics to characterize their plasma properties. All experiments, including those on closed-cavity reactors, were specifically conducted for this study under identical conditions to ensure a rigorous comparison between reactor types. When electrical diagnostics were carried out in helium at various pressures, interesting phenomena such as the evolution of voltage breakdown were observed. These diagnostics also provided new insights into the impact of surface electrode and overall geometry properties and pressure on reactor performance. Additional investigation into instability mechanisms revealed self-pulsing oscillations, with different reactor types having different oscillation amplitudes for similar operating conditions. Optical emission spectroscopy (OES) emerged as a strong tool for spatial plasma analysis, revealing consistent gas temperature distributions across reactor diameters. The Inglis-Teller series provided an estimate of the upper limit of electron density, while the Stark broadening analysis of H α offered valuable insights into electron density variations, particularly in the self-pulsing regime. [ABSTRACT FROM AUTHOR]