Ultraviolet line structuring of large solar wafers: Combining freeform optics and deformable technology for minimized line widths.

Ultrashort‐pulsed lasers are ideal for material processing by welding, marking, and cutting. Scanning systems are crucial for large substrates. We introduce a novel UV line structuring method using deformable mirror technology and freeform optics. This approach aims to improve processing times on large substrates, especially for M12 solar wafer processing. By using a freeform lens and a Zwobbel deformable mirror, we achieve extended processing fields and high scan frequencies. The paper explores optical designs, their robust optomechanical implementation for prototyping, and setup characterization. [ABSTRACT FROM AUTHOR]