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Thermal expansion behavior of nitrogen-processed Al6061/SiC composites.

Authors :
Nayak, Kanhu Charan
Choi, Hyunjoo
Lee, Kon-Bae
Source :
Journal of Materials Science. Oct2024, Vol. 59 Issue 39, p18473-18487. 15p.
Publication Year :
2024

Abstract

Developing of lightweight materials with extremely low thermal expansion is crucial across various sectors. While Invar exhibits a coefficient of thermal expansion (CTE) below 3 × 10āˆ’6 °Cāˆ’1, its heavy nature limits its applicability in electric vehicles and aerospace fields. The present study introduces Al6061/SiC composites produced by the nitrogen-induced self-forming aluminum composite (NISFAC) process, wherein CTE is successfully tailored down to an unprecedented value of 2.12 × 10āˆ’6 °Cāˆ’1 at 100 °C by changing the volume fraction of SiC from 0 to 65%. In-situ AlN, formed at the interface between Al6061 and SiC particles during the NISFAC process, plays a crucial role in minimizing the thermal expansion of the composites by improving crystallographic match and adhesion between SiC particles and the Al matrix. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00222461
Volume :
59
Issue :
39
Database :
Academic Search Index
Journal :
Journal of Materials Science
Publication Type :
Academic Journal
Accession number :
180269683
Full Text :
https://doi.org/10.1007/s10853-024-10170-0