A review on cooling of electronic components using piezoelectric cooler and nanofluid.

MLA

Vimal, A., et al. “A Review on Cooling of Electronic Components Using Piezoelectric Cooler and Nanofluid.” AIP Conference Proceedings, vol. 3221, no. 1, Aug. 2024, pp. 1–7. EBSCOhost, https://doi.org/10.1063/5.0235888.

APA

Vimal, A., Prabhanj, S. R., Edison Thangaraj, J., Navin, R., Mathan, S., & Gopalsamy, S. (2024). A review on cooling of electronic components using piezoelectric cooler and nanofluid. AIP Conference Proceedings, 3221(1), 1–7. https://doi.org/10.1063/5.0235888

Chicago

Vimal, A., S. R. Prabhanj, J. Edison Thangaraj, R. Navin, S. Mathan, and S. Gopalsamy. 2024. “A Review on Cooling of Electronic Components Using Piezoelectric Cooler and Nanofluid.” AIP Conference Proceedings 3221 (1): 1–7. doi:10.1063/5.0235888.