Holographic techniques 'key' to nanofabrication deep within a silicon wafer.

Researchers at Bilkent University in Turkey have developed a new method for nanofabrication deep within a silicon wafer using holographic techniques. By sending laser pulses into the wafer, they were able to achieve controlled nanofabrication without altering the surface. This breakthrough opens up possibilities for advanced photonics and three-dimensional nanofabrication within silicon. The researchers used advanced holographic projection techniques to shape laser beams into nondiffracting Bessel beams, allowing for precise energy localization and modification of the silicon at a small volume. This direct-laser writing method eliminates the need for masks or multiple fabrication steps typically required for conventional nanofabrication. [Extracted from the article]