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A low-pollution surface modification system for improving the adhesion of polycarbonate.
A low-pollution surface modification system for improving the adhesion of polycarbonate.
- Source :
-
Materials Science & Engineering: B . Nov2024, Vol. 309, pN.PAG-N.PAG. 1p. - Publication Year :
- 2024
-
Abstract
- [Display omitted] • In the NaOH-K 2 FeO 4 modified system, PC was hydrolyzed and simultaneously oxidized to co-promote etch modification. • Low use of oxidizing agents in alkaline systems, modified bond strength in line with industry standards. • Reduced pollution of heavy metals such as chromium and manganese, and easy recycling of waste liquid. In the present study, the surface adhesion capacity of polycarbonate (PC) has been improved by using a low-pollution surface modification system that includes alkaline potassium ferrate (K 2 FeO 4). The effects of environmentally friendly swelling conditions, NaOH and K 2 FeO 4 contents, and other modification conditions on the PC surface topography, hydrophilicity, and surface roughness were then primarily studied. The modification resulted in an improvement of the hydrophilic property of the PC surface. There was a significant reduction in the surface contact angle from 97.6° to 34.1°. A considerable increase in the PC surface's average surface roughness (R a) was also observed, which increased from 2 nm to 209 nm. Meanwhile, after chemical copper plating, the maximum peel strength between the PC resin and copper layer reached 1.13 kN/m. Furthermore, infrared absorption spectroscopy (FT–IR) and X–ray photoelectron spectroscopy (XPS) was used in the analyses of the surface chemical structure of the PC substrate, both prior to and after surface treatments. The results indicated that the modification of the surface led to increased hydrophilic groups on the PC surface, which was advantageous for the subsequent PC treatments (involving chemical copper plating). In short, the PC surface modification increased surface roughness and surface hydrophilicity, which improved the bonding between the chemically plated copper layer and the PC substrate. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 09215107
- Volume :
- 309
- Database :
- Academic Search Index
- Journal :
- Materials Science & Engineering: B
- Publication Type :
- Academic Journal
- Accession number :
- 179557660
- Full Text :
- https://doi.org/10.1016/j.mseb.2024.117662