Enhancing thermal conductivity of spherical boron nitride/silicone rubber composites by matching interfacial modulus.

Lightweight, electrically insulating and high thermally conductive materials are highly desirable in electronic and power systems because they can effectively transfer heat and avoid temperature rise of the equipment and devices, thus guaranteeing normal operation. In this work, silica-coated spherical boron nitride (SiO2@s-BN) was successfully fabricated and prepared as a thermally conductive composite by blending with silicone rubber (SR). Due to the modulus matching, SiO2@BN could decrease the thermal resistance between the SR matrices and the thermally conductive fillers, thus achieving higher thermal conductivity compared with the original BN at the same filler loading. When the SR composite is filled with 40 wt% SiO2@BN, the thermal conductivity can reach 1.2 W m−1 K−1, which is 16.5% higher than that of the 40 wt% s-BN/SR composite. Simultaneously, the 40 wt% SiO2@BN/SR composite material not only exhibits excellent dielectric, thermal, and mechanical properties but also demonstrates outstanding processability, maintaining a low precursor viscosity of only 14.5 Pa·s. Overall, this work provides a novel strategy for developing high thermally conductive SR composites with good processability. [ABSTRACT FROM AUTHOR]