Piezoelectric micropump cooler for high-power electronic cooling.

• A micro-liquid cooling system with direct integration of the piezoelectric micropump and heat sink is proposed. • The influence of the copper electrode-to-PZT ratio affected on the performance of the piezoelectric micropump was investigated. • The guidance structure with the fish scale shape is designed and optimized based on the diffuser/nozzle principle. • A simulation model incorporating many physics is developed for piezoelectric micropump cooler(PMC). • Investigations are conducted into PMC's cooling capabilities and operating limit. Micro-liquid cooling is highly effective for the thermal management of electronic chips. However, it is challenging to apply to high heat flux and compact electronic devices because of the limited cooling power and large pump volume. To address this issue, a compact piezoelectric micropump cooler (PMC) integrating a parallel piezoelectric micropump (PPMP) and a heat sink with a fluid guidance structure is designed. The flow and heat transfer performance of the PMC is theoretically optimized through a numerical coupling model considering mechanics, flow-solid heat transfer, and piezoelectric effect. Simulation results suggest that a copper electrode-PZT ratio of 1.4 increases the output flow rate of the PMC, and the design of five fluid guidance structures enhances its heat dissipation effectiveness. Based on the optimized results, the PMC prototype is manufactured employing 3D printing technology. Experimental results show that the flow rate maximum is 62 mL/min with a precision of 0.07 mL/V·min. When the flow rate of PMC increases to 50 mL/min, the temperature of a heat source with 50 W/cm2 can be reduced to 57 °C, which is comparable with the simulation value. The developed model accurately characterizes the heat transfer properties of the PMC thermal management approach, providing a valuable reference for future research. The proposed PMC is characterized by its compact size, high level of integration, and exceptional cooling performance, making it suitable for electronic cooling applications with high heat flux. [Display omitted] [ABSTRACT FROM AUTHOR]