Explore the investigation of structural and morphological characteristics of E-beam evaporated copper thin film of various thicknesses.

A high vacuum E-Beam vacuum coating apparatus used to deposit thin copper films with varying thicknesses (10, 30 and 70 nm). Utilising X-ray diffraction, SEM-EDS, AFM, and UV-visible spectroscopy, the structural, morphological, and optical characteristics of thin copper films are examined in relation to thickness. The film is amorphous at low thickness, according to the XRD diffractogram. With an increase in thickness, the crystallite size increases from 4.6 to 6.4, although the dislocation density and strain have opposing effects. There is good agreement between the Debye Scherrer formula and the Williamson-Hall technique for calculating crystallite size. Its lowers with increasing thickness show that there is less imperfection and no shifting of peaks. The negative strain values across all samples signify the imposition of compressive stress within the films. SEM-EDS spectra described about the pure copper thin film deposition without any impurities. AFM demonstrates that the surface roughness and RMS value is increases from 0.008 to 0.14nm as the thickness increases. [ABSTRACT FROM AUTHOR]