Synthesis of a novel fluorinated polyimide for preparing thermally conductive polyimide composites.

Highlights A fluorinated polyimide (PI‐FTD) was synthesized for preparing a thermally conductive PI matrix and composites. Additionally, surface‐treated boron nitride (BN) was incorporated into the PI‐FTD via the solution casting method to form efficient heat paths along the through‐plane direction. The resultant composite demonstrated remarkable characteristics, including an impressive through‐plane thermal conductivity of 3.6 W mK−1, a substantial tensile strength of 69.4 MPa, and excellent thermal stability. When this composite was applied to light‐emitting diodes, it effectively managed heat, reducing the operating temperature by 29°C. The PI‐FTD/BN‐OH composites can potentially improve thermal management in electronic devices. A novel fluorinated polyimide (PI‐FTD) was fabricated. Introducing CF3 functionalities in the PI‐FTD provides high thermal stability. BN‐OH reinforced the thermal and mechanical properties of the composites. The PI‐FTD/BN‐OH composites achieved excellent thermal management. [ABSTRACT FROM AUTHOR]