The effect of boron anomaly on the dielectric properties and thermal expansion of barium borosilicate glasses for 3D packaging systems.

Barium borosilicate (BBS) glass is a potential three-dimensional system packaging and sensor cover material. In this study, we prepared glass samples with different SiO 2 /B 2 O 3 ratios based on the revised model of Dell and Bray and discussed the effect of boron anomaly on dielectric and thermal properties through Raman spectroscopy. The results indicate that the [BO 4 ] tetrahedrons are beneficial in reducing the dielectric constant and dielectric loss to a certain extent, while the improvement in the coefficient of thermal expansion (CTE) is attributed to the depolymerization of the glass network by the [BO 3 ] triangles. After the disappearance of the boron anomaly, a certain amount of dielectric performance is sacrificed in exchange for an increase in the CTE. When the substitution rate of B 2 O 3 for SiO 2 reaches 15.12 mol%, the CTE of the sample increases to 8.43 × 10−6/°C, in addition, the dielectric constant and dielectric loss decrease to 4.90 and 0.0071 (@1 GHz), respectively. In summary, this work provides a suitable method for preparing glass with a high coefficient of expansion and low dielectric loss to address the thermal mismatch effect of different materials in electronic packaging systems. [ABSTRACT FROM AUTHOR]