Determining the thickness of semi-transparent thin films via reflectivity measurements based on optical properties.

This study addresses the challenge of measuring deposited film thickness during semiconductor manufacturing in real-time. Accordingly, we present the development of a sensor capable of measuring the deposition and growth thickness of wafers within a chamber in situ. Using a laser measurement instrument, we designed a sensor equipped with a light-receiving component to capture the reflected light signals. Our experimental results confirm the feasibility of real-time measurements; the oxide and nitride films are measured with a deviation of 10 nm or less and a minimum error factor as low as 0.68 %. This sensor is promising for improving the efficiency and accuracy of film thickness measurements in semiconductor manufacturing processes. [ABSTRACT FROM AUTHOR]