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A NON-DESTRUCTIVE EVALUATION OF MICROSTRUCTURAL ANALYSIS IN SN-AG-CU SOLDER JOINT BY SYNCHROTRON X-RAY RADIATION TOMOGRAPHY.
- Source :
-
Archives of Metallurgy & Materials . 2024, Vol. 69 Issue 2, p661-665. 5p. - Publication Year :
- 2024
-
Abstract
- This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 µm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 17333490
- Volume :
- 69
- Issue :
- 2
- Database :
- Academic Search Index
- Journal :
- Archives of Metallurgy & Materials
- Publication Type :
- Academic Journal
- Accession number :
- 178221341
- Full Text :
- https://doi.org/10.24425/amm.2024.149795